Forming method of solder resist

ソルダーレジストの形成方法

Abstract

PROBLEM TO BE SOLVED: To provide an easy formation method of a solder resist which is extremely versatile and effectively prevents a foreign matter from sticking to a resist surface without depending on a pattern of the solder resist. SOLUTION: In the method, the solder resist is formed by heat treatment after exposure and development by forming a resist layer on a base material surface, and providing a solder resist pattern on the resist layer after volatilizing a solvent element inside the resist layer by drying the resist layer. After the solvent element inside the resist layer is volatilized by drying the resist layer, a light transmitting protection film is laminated on the resist layer surface, and exposure is carried out by providing a solder resist pattern on the protection film. Thereafter, the protection film is removed and development is carried out. COPYRIGHT: (C)2004,JPO
【課題】ソルダーレジストのパターンに依存せず、レジスト表面への異物の付着を効果的に防止できる、簡単かつ汎用性に富むソルダーレジストの形成方法を提供する。 【解決手段】基材表面にレジスト層を設け、該レジスト層を乾燥してレジスト層内の溶媒成分を揮発させた後、該レジスト層の上にソルダーレジストパターンを設けて露光し、現像後、加熱処理してソルダーレジストを形成する方法において、前記レジスト層を乾燥してレジスト層内の溶媒成分を揮発させた後、該レジスト層表面に光透過性の保護フィルムをラミネートし、該保護フィルムの上にソルダーレジストパターンを設けて露光した後、保護フィルムを除去し、現像することを特徴とする。 【選択図】   図1

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (2)

    Publication numberPublication dateAssigneeTitle
    EP-1648209-A1April 19, 2006Nitto Denko CorporationVerfahren zur Herstellung einer Leiterplatte
    US-7396635-B2July 08, 2008Nitto Denko CorporationProducing method of wired circuit board