絶縁膜用材料、絶縁膜用コーティングワニス、及びこれを用いた絶縁膜

Insulating film material, coating varnish for insulating film and insulating film using this

Abstract

【課題】半導体用途において、熱特性、電気特性、吸水性に優れ、特に、比誘電率の極めて低い耐熱性の絶縁膜を提供する。 【解決手段】特定構造の繰り返し単位を有するポリアミドと、オリゴマーとが均一に溶解した混合物を必須成分とすることを特徴とする絶縁膜用樹脂組成物。
PROBLEM TO BE SOLVED: To provide a heat resisting insulating film excellent in heat characteristic, electrical characteristic and water absorption, and particularly, with an extremely low inductive capacity. SOLUTION: The resin composition for the insulating film has a composite of polyamide provided with a repeating unit of a specific structure and oligomers dissolved uniformly as an essential component. COPYRIGHT: (C)2004,JPO

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    JP-2007063202-AMarch 15, 2007Sumitomo Bakelite Co Ltd, 住友ベークライト株式会社ビスアミノフェノール化合物